Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same

ABSTRACT

Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil. 
     The present invention relates to a thermosetting resin composition of a semi-IPN composite, comprising (A) a polyphenylene ether, and a prepolymer formed from (B) a chemically unmodified butadiene polymer containing 40% or more of a 1,2-butadiene unit having a 1 2,-vinyl group in a side chain of a molecule and (C) a crosslinking agent, in a compatibilized and uncured state; and a resin varnish, a prepreg and a metal clad laminated board using the same.

TECHNICAL FIELD

The present invention relates to a thermosetting resin composition of anovel semi-IPN composite, and a resin varnish, a prepreg and a metalclad laminate for printed circuit boards using the same. Moreparticularly, the present invention relates to a thermosetting resincomposition of a novel semi-IPN composite used in electronic devicessuch as those having an operating frequency exceeding 1 GHz, and a resinvarnish, a prepreg and a metal clad laminated board for printed circuitboards using the same.

BACKGROUND ART

It is demanded in mobile telecommunication devices represented bycellular phones and base stations thereof, network-associated electronicdevices such as servers and routers, and large scale computers, totransmit and process large amounts of data at a high speed with lowloss. In the case of transmitting and processing large amounts of data,since electric signals are of high frequencies, rapid transmission andprocessing of data can be achieved. However, in principle, when thefrequency of an electric signal increases, the signal is definitelyprone to attenuate; that is, high frequency electric signal is prone tohave weakened output power, with shorter transmission distance, and hasproperties that are likely to cause high loss. Therefore, in order tomeet the above-mentioned requirements of low loss and high speed, it isnecessary to reduce the transmission loss, particularly the transmissionloss in high frequency bands, among the properties of a printed circuitboard itself which is mounted in a device and performs transmission andprocessing of data.

To obtain printed circuit boards having low transmission loss, substratematerials utilizing fluorine-based resins having low dielectric constantand low dielectric dissipation factor have been traditionally used.However, fluorine-based resins in general have high melting temperaturesand high melt viscosities, while having relative low fluidity. Thus, theresins have a problem of requiring the setting of high temperature andhigh pressure conditions in press molding. Moreover, fluorine-basedresins also have a problem that their workability, dimensionalstability, and adhesiveness to metal plating are insufficient to be usedfor the applications in high multilayer printed circuit boards that areused in the aforementioned telecommunication devices, network-associatedelectronic devices, and large scale computers.

Thus, there has been conducted research on the resin materials forprinted circuit boards to cope with high frequency applications and toreplace the fluorine-based resins. Among them, use of polyphenyleneether which is known as one of the resins having the most excellentdielectric properties among heat resistant polymers, is attracting moreattention. However, polyphenylene ether is a thermoplastic resin havinghigh melting temperature and high melt viscosity, as is the case of thefluorine-based resins. Therefore, for the applications in printedcircuit boards, resin compositions containing polyphenylene ether and athermosetting resin in combination have been used, in order to lower themelting point and melt viscosity, and to thereby set the temperature andpressure conditions low during press molding, or for the purpose ofimparting thermal resistance to polyphenylene ether to withstand atemperature greater than the melting temperature (230 to 250° C.). Forexample, a resin composition using an epoxy resin in combination (seePatent Document 1), a resin composition using a bismaleimide incombination (see Patent Document 2), a resin composition using a cyanateester in combination (see Patent Document 3), a resin composition usinga styrene-butadiene copolymer, or polystyrene with triallyl cyanurate ortriallyl isocyanurate in combination (see Patent Documents 4 and 5), aresin composition using polybutadiene in combination (see PatentDocument 6 and Patent Document 7), a resin composition prepared bypreliminarily-reacting a modified polybutadiene having a functionalgroup such as a hydroxyl group, an epoxy group, a carboxyl group or a(meth)acryl group, with bismaleimide and/or a cyanate ester (see PatentDocument 8), a resin composition using triallyl cyanurate, triallylisocyanurate, polybutadiene or the like in combination with apolyphenylene ether which has been granted or grafted with a compoundhaving a group having an unsaturated double bond (see Patent Document 9and Patent Document 10), a resin composition using a reaction product ofpolyphenylene ether and an unsaturated carboxylic acid or unsaturatedacid anhydride, and bismaleimide or the like in combination (see PatentDocument 11), and the like have been proposed. According to thesedocuments, it is disclosed that in order to improve the above-describeddefects of thermoplasticity while maintaining the properties of lowtransmission loss of polyphenylene ether, the resin obtained aftercuring preferably does not have many polar functional groups.

-   [Patent Document 1] Japanese Patent Application Laid-Open No.    58-69046-   [Patent Document 2] Japanese Patent Application Laid-Open No.    56-133355-   [Patent Document 3] Japanese Published Examined Application No.    61-18937-   [Patent Document 4] Japanese Patent Application Laid-Open No.    61-286130-   [Patent Document 5] Japanese Patent Application Laid-Open No.    3-275760-   [Patent Document 6] Japanese Patent Application Laid-Open No.    62-148512-   [Patent Document 7] Japanese Patent Application Laid-Open No.    59-193929-   [Patent Document 8] Japanese Patent Application Laid-Open No.    58-164638-   [Patent Document 9] Japanese Patent Application Laid-Open No.    2-208355-   [Patent Document 10] Japanese Patent Application Laid-Open No.    6-184213-   [Patent Document 11] Japanese Patent Application Laid-Open No.    6-179734

DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention

The inventors of the present invention examined in detail resincompositions using polyphenylene ether and a thermosetting resin incombination, including the resin compositions described in PatentDocuments 1 to 11, and their applicability to the applications in thelaminates of printed circuit boards.

As a result, the resin compositions disclosed in Patent Document 1,Patent Document 2 and Patent Document 11 exhibited deteriorateddielectric properties after curing under the influence of highly polarepoxy resins or bismaleimide, and thus were unsuitable for theapplications involving high frequencies.

The composition using a cyanate ester in combination as disclosed inPatent Document 3 had excellent dielectric properties, but the heatresistance deteriorated after moisture absorption.

The compositions using triallyl cyanurate or triallyl isocyanurate incombination as disclosed in Patent Documents 4 and 5, Patent Document 9and Patent Document 10 exhibited slightly higher relativepermittivities, as well as a tendency that the drift in the dielectricproperties concomitant to moisture absorption is large.

The resin compositions using polybutadiene in combination as disclosedin Patent Documents 4 to 7 and Patent Document 10 had excellentdielectric properties, but had problems such as that the strength of theresins themselves was low, or that the thermal expansion coefficient washigh. Thus, the resin compositions were inappropriate for theapplications in high multilayer printed circuit boards.

Patent Document 8 discloses a resin composition using modifiedpolybutadiene in combination so as to improve the adhesiveness to metalsand glass substrates. However, there was a problem that the dielectricproperties, particularly in the high frequency region of 1 GHz or more,were largely deteriorated, as compared to the case of using unmodifiedpolybutadiene.

Furthermore, the composition using a reaction product of a polyphenyleneether and an unsaturated carboxylic acid or unsaturated acid anhydride,as disclosed in Patent Document 11, had poor dielectric properties, ascompared to the case of using a typical polyphenylene ether, under theinfluence of a highly polar unsaturated carboxylic acid or unsaturatedacid anhydride.

Thus, it is believed that there is a demand for a thermosetting resincomposition containing PPE, which has the above-described defects ofthermoplasticity improved, and also has excellent dielectric properties.

Furthermore, the inventors of the present invention paid attention tothe dielectric properties, and particularly to the lowering oftransmission loss, and conducted research. Thus, the inventors foundthat when only a resin having low permittivity and low dielectricdissipation factor is used, it is insufficient as the countermeasure tothe increasingly higher frequencies granted to electric signals inrecent years. Since the transmission loss of electric signal isclassified as a loss caused by an insulating layer (dielectric loss) anda loss caused by conductive layer (conductor loss), in the case of usinga resin having a low dielectric constant and a low dielectricdissipation factor, only the dielectric loss is lowered. In order tofurther reduce the transmission loss, it is necessary to reduce theconductor loss as well.

As a method for devising this lowering of conductor loss, a method ofemploying a metal clad laminated board which makes use of a metal foilhaving less surface unevenness on the side of the roughened surface(hereinafter, referred to as “M surface”), which is the surface adheringa conductor layer and an insulating layer, more specifically, a metalfoil having a surface roughness (ten points average roughness; Rz) of 5μm or less for the M surface (hereinafter, referred to as “low profilefoil”), or the like can be used.

Therefore, the inventors of the present invention conducted aninvestigation on the use of a thermosetting resin having a lowdielectric constant and a low dielectric dissipation factor as thematerial for printed circuit boards for high frequency applications, anda low profile foil as the metal foil.

However, as a result of the research carried out by the inventors, itwas found that when the resin compositions described in Patent Documents1 to 11 are used to produce laminates with low profile foil, theadhesive power (bonding power) between an insulating (resin) layer and aconductor (metal foil) layer is weakened, and thus the required peelingstrength cannot be secured. This is conceived to be attributable to thelow polarity of the resin, and the lowered anchoring effectsattributable to the unevenness of the M surface of the metal foil.Furthermore, in a test for heat resistance after moisture absorptionconducted with these laminates, a failure of delamination between theresin and the metal foil occurred. This is conceived to be attributableto the low adhesive power between the resin and the metal foil. Fromsuch results, the inventors of the present invention found anotherproblem, in addition to the above-disclosed problems, that it isdifficult to apply these resin compositions described in PatentDocuments 1 to 11 with metal foil having small surface roughness, suchas low profile foil.

In particular, the following was conspicuous in the system ofpolyphenylene ether and butadiene homopolymer. These resins areimmiscible with each other by nature, and can hardly be made into ahomogeneous resin. Thus, in the case of directly using resincompositions containing these resins, there is a problem of havingtackiness while being in an uncured state, which is a defect ofbutadiene homopolymer systems, and therefore, a prepreg having uniformexternal appearance and good workability cannot be obtained. Also, inthe case of producing a metal clad laminated board using this prepregand a metal foil, the resin undergoes curing in a non-uniform state(macro-phase separation state). Thus, in addition to the problem ofexternal appearance, there occurs a decrease in the heat resistanceafter moisture absorption, and the defects of the butadiene homopolymersystem are highlighted, thus various flaws such as low fracture strengthor large thermal expansion coefficient occurred.

Furthermore, the peeling strength between the prepreg and the metal foilwas also of low level, even without the strength with which low profilefoil can be applied. In this regard, it is conceived that low cohesivefailure strength of the resin in the area adjacent to the metal foilduring peeling-off is affecting as a more major factor, rather than thelow interfacial adhesive power between the butadiene homopolymer and themetal foil.

Thus, in an attempt to address the problems described above, it is anobject of the present invention to provide a thermosetting resincomposition usable in the production of printed circuit boards, whichcomposition has good dielectric properties particularly in highfrequency bands, thus being capable of significantly lowering thetransmission loss, and has excellent heat resistance after moistureabsorption and thermal expansion properties, as well as satisfactorypeeling strength from metal foil; and a resin varnish, a prepreg and ametal clad laminated board using the same.

Embodiments of the present invention are not to be defined as inventionswhich solve all of the problems exhibited in the related art.

Means for Solving the Problems

Japanese Patent Applications Nos. 2006-4067, 2006-1116405 and2006-246722, all filed by the inventors and applicant of the presentinvention, are incorporated in the present specification by reference intheir entirety for all purposes.

To solve the problems described above, the inventors of the presentinvention have devotedly and repeatedly conducted research on resincompositions containing polyphenylene ether, and as a result, theyachieved a thermosetting resin composition of a semi-IPN composite,comprising a polyphenylene ether and a prepolymer formed from a specificbutadiene polymer, which are compatibilized and uncured, the compositionbeing a thermosetting resin composition containing a compatibilized,uncured polyphenylene ether-modified butadiene polymer produced by anovel and unique method of compatibilization. The inventors also foundthat when this resin composition is used for the applications in printedcircuit boards, the resin composition has good dielectric properties inhigh frequency bands and excellent properties of lowering transmissionloss, and can exhibit good heat resistance after moisture absorption anda low thermal expansion coefficient. The inventors also found that sincethis resin composition has high peeling strength from metal foil, theresin composition can be applied even to a metal foil having smallsurface roughness, such as low profile foil in particular, thusestablishing the present invention.

Thus, the present invention relates to a thermosetting resin compositionof a semi-IPN composite, comprising (A) a polyphenylene ether, and aprepolymer formed from (B) a butadiene polymer which is not chemicallymodified and contains 40% or more of a 1,2-butadiene unit having a1,2-vinyl group in a side chain of a molecule and (C) a crosslinkingagent, the polyphenylene ether and the prepolymer being in acompatibilized and uncured state.

The present invention also relates to a thermosetting resin compositionof a semi-IPN composite, the semi-IPN composite comprising a radicalpolymerizable polymer formed by radical polymerization of (A) apolyphenylene ether, (B) a butadiene polymer and (C) a crosslinkingagent, wherein

component (B) is a butadiene polymer which is not chemically modifiedand contains (j) a —[CH₂—CH═CH—CH₂]— unit and (k) a —[CH₂—CH(CH═CH₂)]—unit, with the ratio of j:k being from 60:40 to 5:95; and

component (C) is a compound having one or more ethylenically unsaturateddouble bonds in a molecule.

The present invention relates to a thermosetting resin composition of anuncured semi-IPN composite, comprising a polyphenylene ether-modifiedbutadiene prepolymer obtained by preliminarily-reacting (B) a butadienepolymer which is not chemically modified and contains 40% or more of a1,2-butadiene unit having a 1,2-vinyl group in a side chain of amolecule, with (C) a crosslinking agent, in the presence of (A) apolyphenylene ether.

The present invention also relates to a resin composition comprising apolyphenylene ether-modified butadiene prepolymer obtained bypreliminarily-reacting (B) a butadiene polymer which is not chemicallymodified and contains 40% or more of a 1,2-butadiene unit having a1,2-vinyl group in a side chain of a molecule, with (C) a crosslinkingagent, in the presence of (A) a polyphenylene ether, so that aconversion rate of component (C) is in the range of 5 to 100%, andpreferably 5 to 80%.

The present invention relates to a resin composition wherein thecomponent (C) contains at least one maleimide compound represented bythe formula (1):

-   -   wherein R₁ is an aliphatic or aromatic organic group having a        valence of m;        -   Xa and Xb, which may be identical or different from each            other, each is a monovalent atom or organic group selected            from a hydrogen atom, a halogen atom and an aliphatic            organic group; and        -   m represents an integer of 1 or greater.

The present invention relates to a resin composition, wherein thecomponent (C) is at least one maleimide compound selected from the groupconsisting of N-phenylmaleimide, N-(2-methylphenyl)maleimide,N-(4-methylphenyl)maleimide, N-(2,6-dimethylphenyl)maleimide,N-(2,6-diethylphenyl)maleimide, N-(2-methoxyphenyl)maleimide,N-benzylmaleimide, N-dodecylmaleimide, N-isopropylmaleimide andN-cyclohexylmaleimide.

The present invention relates to a resin composition, wherein thecomponent (C) is at least one maleimide compound containing2,2-bis(4-(4-maleimidophenoxy)phenyl)propane.

The present invention relates to a resin composition wherein thecomponent (C) is at least one maleimide compound containingbis(3-ethyl-5-methyl-4-maleimidophenyl)methane.

The present invention relates to a resin composition, wherein thecomponent (C) is at least one vinyl compound containing divinylbiphenyl.

The present invention relates to a resin composition, wherein a mixingproportion of the component (A) is in the range of 2 to 200 parts byweight based on 100 parts by weight of the total amount of the component(B) and component (C), and a mixing proportion of the component (C) isin the range of 2 to 200 parts by weight based on 100 parts by weight ofthe component (B).

The present invention also relates to a resin composition, furthercomprising (D) a radical reaction initiator.

The present invention relates to a resin composition, further comprising(E) a crosslinkable monomer or crosslinkable polymer which does notconstitute the uncured semi-IPN composite and contains one or moregroups having an ethylenically unsaturated double bond in a molecule.

The present invention relates to a resin composition, wherein thecomponent (E) is a crosslinkable monomer or crosslinkable polymercontaining at least one group having an ethylenically unsaturated doublebond, selected from the group consisting of a chemically unmodifiedbutadiene polymer, a maleimide compound and a styrene-butadienecopolymer.

The present invention relates to a resin composition, further comprising(F) at least any one of a bromine-based flame retardant and aphosphorus-based flame retardant.

The present invention relates to a resin composition, further comprising(G) an inorganic filler.

The present invention relates to a resin varnish for printed circuitboards obtained by dissolving or dispersing the above-mentioned resincomposition in a solvent.

The present invention relates to a prepreg obtained by impregnating theresin varnish into a substrate for printed circuit boards, and thendrying the impregnated prepreg.

The present invention relates to a metal clad laminated board obtainedby stacking one sheet or more of the prepreg for printed circuit boards,disposing metal foil on one side or both sides of the stacked prepreg,and pressing them together while heating.

EFFECTS OF THE INVENTION

According to the present invention, a printed circuit board using theresin composition and the like of the present invention can achieveexcellent high frequency properties and good heat resistance aftermoisture absorption or low thermal expansion properties. Furthermore, aresin composition achieving the peeling strength between the resincomposition and metal foil to a sufficiently high level, and a resinvarnish, a prepreg and a metal clad laminated board using the same canbe provided. Therefore, the resin composition and the like of thepresent invention are useful for the applications in members andelements of printed circuit boards that are used in various electric andelectronic devices, such as mobile telecommunication devices dealingwith signals of high frequencies of 1 GHz or greater, or devices for thebase stations, network-associated electronic devices such as servers androuters, and large scale computers.

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, suitable embodiments of the present invention will bedescribed in detail.

The reason why the thermosetting resin composition of a novel semi-IPNcomposite of the present invention can achieve the above-describedobjects has not been clarified in detail. The inventors of the presentinvention have arrived at the following presumption, but do not intendto exclude the possible involvement of other factors.

The present invention aims at significantly enhancing dielectricproperties by containing polyphenylene ether which is a thermoplasticresin having good dielectric properties, and a chemically unmodifiedbutadiene polymer, which is known as one of the thermosetting resinsexhibiting the most excellent dielectric properties, as the essentialcomponents. As discussed in the above, polyphenylene ether and achemically unmodified butadiene polymer are originally immiscible witheach other, and it is difficult to blend them into a homogeneous resin.However, a homogeneously compatibilized resin with a novel constitutioncan be obtained by a technique of using the preliminary reaction of thepresent invention.

In the present invention, the preliminary reaction involves generatingradicals at a reaction temperature of, for example, 60 to 170° C. toallow reaction between the component (B) and the component (C), and apredetermined amount of the material from the component (B) undergoescrosslinking, while a predetermined amount of the component (C) isconverted. That is, this state is an uncured state which has not reachedgelation. A mixture of the component (A), the component (B) and thecomponent (C) before and after this preliminary reaction, and a semi-IPNpolymer can be easily distinguished on the basis of viscosity,turbidity, and changes in the characteristic peaks in liquidchromatography.

In addition, a so-called curing reaction in general is to cure bypressing while heating or to cure by generating radicals at atemperature above the volatilization temperature of a solvent, and thusis obviously different from the preliminary reaction according to thepresent invention.

In the present invention, the chemically unmodified butadiene polymer ofthe component (B) containing 40% or more of a 1,2-butadiene unit havinga 1,2-vinyl group in the side chain in the molecule and the crosslinkingagent of the component (C) are subjected to a preliminary reaction at anappropriate conversion rate (reaction rate) in the presence of thepolyphenylene ether of the component (A), to obtain a polyphenyleneether-modified butadiene prepolymer in which a so-called “semi-IPN” isformed between one part of a linear polymer component (herein, thecomponent (A), solid lines) and the other part of a crosslinkablecomponent (herein, the components (B) and (C), dotted lines), in anuncured state of before complete curing, and thus a homogeneous resincomposition is obtained (thermosetting resin composition of an uncuredsemi-IPN composite; see the following diagram). It is conceived thathomogenization (compatibilization) in this case is not related toforming chemical bonds between the component (A) and the other component(partial crosslinking product between the component (B) and thecomponent (C)), but is related to oligomerization resulting from partialand physical mutual entanglement of the molecular chains of thecomponent (A) and the other component. Therefore, it is conceived thatthe components form a microphase-separated structure, and can beapparently homogenized (compatibilized).

A resin composition containing this polyphenylene ether-modifiedbutadiene prepolymer (thermosetting resin composition of an uncuredsemi-IPN composite) can yield a resin film having an apparently uniformexternal appearance. A polyphenylene ether-modified butadieneprepolymer, such as one conventionally known, does not form semi-IPN perse, and the constituent components thereof are not compatibilized.Therefore, the polymer can be said to be in a phase-separation state.For that reason, the polymer is different from the composition of thepresent invention, and a conventional polyphenylene ether-modifiedbutadiene prepolymer undergoes macro-phase separation which appearsinhomogeneous.

A prepreg produced using the resin composition containing apolyphenylene ether-modified butadiene prepolymer of the presentinvention (thermosetting resin composition of an uncured semi-IPNcomposite) has a uniform external appearance, and since a butadieneprepolymer which is crosslinked to a certain extent, and polyphenyleneether which is originally non-tacky, are in a state of beingcompatibilized at the molecular level, the problem of tackiness iseliminated. Furthermore, a metal clad laminated board produced usingthis prepreg has no problem in the external appearance as in the case ofthe prepreg, and since curing occurs while the molecular chains arepartially and physically entangled with each other, thepseudo-crosslinking density becomes higher than that in the case ofcuring a resin composition in a non-homogeneous state. Thus, elasticityis increased, and the thermal expansion coefficient is lowered. Theincrease in elasticity and the formation of a uniformmicrophase-separated structure can bring forth a large increase in thefracture strength or heat resistance (particularly, after moistureabsorption) of the resin. Furthermore, the increase in the fracturestrength of the resin can lead to the manifestation of a metal foilpeeling strength as high as to a level where low profile foil can beapplied. Also, it was found that when a specific crosslinking agentwhich would impart features such as increasing the resin strength ortoughness when the resin is cured, or restraining molecular movement, isselected as the component (C), the metal foil peeling strength and thethermal expansion properties can be enhanced to higher levels.

The novel thermosetting resin composition of a semi-IPN composite of thepresent invention contains a polyphenylene ether-modified butadieneprepolymer obtained by preliminarily-reacting a butadiene homopolymer ofcomponent (B) containing 40% or more of a 1,2-butadiene unit having a1,2-vinyl group in a side chain of a molecule, and a crosslinking agentof component (C), in the presence of a polyphenylene ether of component(A). Hereinafter, various components of the resin composition and asuitable method for producing the polyphenylene ether-modified butadieneprepolymer will be discussed.

In the novel thermosetting resin composition of a semi-IPN composite ofthe present invention, the component (A) used in the production of thepolyphenylene ether-modified butadiene prepolymer may be exemplified bypoly(2,6-dimethyl-1,4-phenylene) ether orpoly(2,3,6-trimethyl-1,4-phenylene) ether obtained by homopolymerizationof 2,6-dimethylphenol or 2,3,6-trimethylphenol, a copolymer of2,6-dimethylphenol and 2,3,6-trimethylphenol, or the like. An alloyingpolymer of one of the foregoing polymers with polystyrene, astyrene-butadiene copolymer or the like, that is, a so-called modifiedpolyphenylene ether, can also be used. However, in this case, a polymercontaining 50% or more of the component ofpoly(2,6-dimethyl-1,4-phenylene) ether, the component ofpoly(2,3,6-trimethyl-1,4-phenylene) ether, or the component of copolymerof 2,6-dimethylphenol and 2,3,6-trimethylphenol, is more preferred.

The molecular weight of the component (A) is not particularly limited,but in consideration of the balance between the dielectric properties orheat resistance when the resin composition is used in printed circuitboards, and the fluidity of resin when the resin composition is used inprepregs, it is preferable that the number average molecular weight isin the range of 7000 to 30000. In addition, the number average molecularweight as used herein is a value obtained by performing a measurement bygel permeation chromatography, and calculated on the basis ofcalibration curve constructed using standard polystyrene.

The component (B) used in the production of a polyphenyleneether-modified butadiene prepolymer in the present invention is notparticularly limited, as long as it is a butadiene polymer whichcontains 40% or more of a 1,2-butadiene unit having a 1,2-vinyl group inthe side chain in the molecule, and is not chemically modified. Thebutadiene polymer is not a modified polybutadiene in which the 1,2-vinylgroup in the side chain, or one or both of the terminals in the moleculeis chemically modified to be converted to epoxy, glycol, phenol, maleicacid, (meth)acryl, urethane or the like, and is essentially anon-modified butadiene polymer. When a modified polybutadiene is used,the dielectric properties, moisture resistance and heat resistance aredeteriorated, and thus it is not desirable.

The content of the 1,2-butadiene unit having a 1,2-vinyl group in theside chain in a molecule of the component (B) is preferably 50% or more,and more preferably 65% or more, from the viewpoint of the curability ofthe resin composition. The number average molecular weight of thecomponent (B) is preferably in the range of 500 to 10,000. If the numberaverage molecular weight is larger than 10,000, fluidity of the resin isdeteriorated when the resin composition is used in prepregs, and thus itis not preferable. If the number average molecular weight is less than500, curability of the resin composition or the dielectric propertiesobtained when the resin composition is cured are deteriorated, and thusit is not preferable. Considering the balance between the curability ofthe resin composition or the dielectric properties obtained when theresin composition is cured, and the fluidity of resin when the resincomposition is used in prepregs, the number average molecular weight ismore preferably in the range of 700 to 8000, and even more preferably inthe range of 1000 to 5000. Additionally, the number average molecularweight has the same definition as described with regard to the component(A).

As the component (B), a chemically unmodified butadiene polymercomprising a —[CH₂—CH═CH—CH₂]— unit (j) and a —[CH₂—CH(CH═CH₂)]— unit(k), with a ratio of j:k being 60 to 5:40 to 95, can be used.

Specific examples of the component (B) suitably used in the presentinvention include B-1000, B-2000, B-3000 (manufactured by Nippon SodaCo., Ltd., trade name), B-1000, B-2000, B-3000 (manufactured by NipponPetrochemicals Co., Ltd., trade name), Ricon142, Ricon150, Ricon152,Ricon153, Ricon154 (manufactured by Sartomer Company, trade name), andthe like are commercially available.

The component (C) used in the production of the polyphenyleneether-modified butadiene prepolymer in the present invention is acompound having a functional group which is reactive to the component(B) in the molecule, and for example, a crosslinkable monomer orcrosslinkable polymer containing one or more groups having anethylenically unsaturated double bond in the molecule may be mentioned.Specific examples of the component (C) include vinyl compounds,maleimide compounds, diallyl phthalate, (meth)acryloyl compounds,unsaturated polyesters, styrene-butadiene copolymers and the like. Amongthese, the component (C) that can be suitably used may include at leastone maleimide compound or at least one vinyl compound, since thesecompounds are desirable from the viewpoints that the compounds enhancethe curability or storage stability of a resin composition containingthe compounds because they have excellent co-crosslinkability with thecomponent (B), and that the total balance of molding property,dielectric properties, dielectric properties after moisture absorption,thermal expansion properties, metal foil peeling strength, Tg, heatresistance after moisture absorption, and flame resistance is excellentwhen the resin composition is used in printed circuit boards.

The maleimide compound that can be suitably used as the component (C) ofthe present invention is not particularly limited, as long as it is acompound containing one or more maleimide groups in the moleculerepresented by the following formula (1). A monomaleimide compound or apolymaleimide compound represented by the following formula (2) can besuitably used.

-   -   wherein R₂ is a monovalent or polyvalent organic group having a        valence of m, and being any one of aliphatic, alicyclic,        aromatic and heterocyclic; Xa and Xb, which may be identical or        different from each other, each is a monovalent atom or organic        group selected from a hydrogen atom, a halogen atom and an        aliphatic organic group; and m represents an integer of 1 or        greater.

-   -   wherein R₂ is —C(Xc)₂—, —CO—, —O—, —S—, —SO₂— or a linking bond,        while a plurality of R₂ may be identical with or different from        each other; Xc represents an alkyl group having 1 to 4 carbon        atoms, —CF₃, —OCH₃, —NH₂, a halogen atom or a hydrogen atom,        while a plurality of Xc may be identical with or different from        each other, and their positions of substitution on the benzene        ring is independent of each other; and n and p each represent an        integer from 0 to 10.

Specific examples of the above-mentioned monomaleimide compound includeN-phenylmaleimide, N-(2-methylphenyl)maleimide,N-(4-methylphenyl)maleimide, N-(2,6-dimethylphenyl)maleimide,N-(2,6-diethylphenyl)maleimide, N-(2-methoxyphenyl)maleimide,N-benzylmaleimide, N-dodecylmaleimide, N-isopropylmaleimide,N-cyclohexylmaleimide and the like.

Specific examples of the polymaleimide compound represented by theformula (2) include 1,2-dimaleimidoethane, 1,3-dimaleimidopropane,bis(4-maleimidophenyl)methane, bis(3-ethyl-4-maleimidophenyl)methane,bis(-ethyl-5-methyl-4-maleimidophenyl)methane, 2,7-dimaleimidofluorene,N,N′-(1,3-phenylene)bismaleimide,N,N′-(1,3-(4-methylphenylene))bismaleimide,bis(4-maleimidophenyl)sulfone, bis(4-maleimidophenyl)sulfide,bis(4-maleimidophenyl)ether, 1,3-bis(3-maleimidophenoxy)benzene,1,3-bis(3-(3-maleimidophenoxy)phenoxy)benzene, bis(4-maleimidophenyl)ketone, 2,2-bis(4-(4-maleimidophenoxy)phenyl)propane,bis(4-(4-maleimidophenoxy)phenyl)sulfone,bis[4-(4-maleimidophenoxy)phenyl]sulfoxide,4,4′-bis(3-maleimidophenoxy)biphenyl,1,3-bis(2-(3-maleimidophenyl)propyl)benzene,1,3-bis(1-(4-(3-maleimidophenoxy)phenyl)-1-propyl)benzene,bis(maleimidocyclohexyl)methane,2,2-bis[4-(3-maleimidophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane,bis(maleimidophenyl)thiophene, aliphatic, alicyclic, aromatic andheterocyclic polymaleimides represented by the following formula (3) andthe following formula (4), and the like (provided that they includetheir respective isomers). From the viewpoints of moisture resistance,heat resistance, fracture strength, metal foil peeling strength and lowthermal expansion properties obtained when the resin composition is usedin printed circuit boards, an aromatic polymaleimide is preferred, andamong them, it is more preferable to usebis(3-ethyl-5-methyl-4-maleimidophenyl)methane from the viewpoint offurther lowering the thermal expansion coefficient in particular, and itis more preferable to use 2,2-bis(4-(4-maleimidophenoxy)phenyl)propanefrom the viewpoint of further increasing the fracture strength and metalfoil peeling strength. Furthermore, a monomaleimide allowing a mildcuring reaction is preferred from the viewpoint of increasing themolding property when the resin composition is used in prepregs, andamong them, it is more preferable to use N-phenylmaleimide from theviewpoint of costs. The maleimide compounds may be used individually, orin combination of two or more species. Also, at least one of thesemaleimide compounds and one or more of the crosslinking agents shown inthe above may be used in combination.

In the case of using a maleimide compound and another crosslinking agentin combination as the component (C), the proportion of the maleimidecompound in the component (C) is preferably 50% by weight or more, andmore preferably 80% by weight or more. However, it is more preferable touse maleimide compounds alone, rather than to use with othercrosslinking agents in combination.

-   -   wherein q is from 0 to 10 as an average value.

-   -   wherein r is from 0 to 10 as an average value.

The vinyl compound that can be suitably used as the component (C) may beexemplified by styrene, divinylbenzene, vinyltoluene or divinylbiphenyl.Divinylbiphenyl is preferred.

As a specific example of the component (B) that can be suitably used inthe present invention, divinylbiphenyl (manufactured by Nippon SteelChemical Co., Ltd.) is commercially available.

The polyphenylene ether-modified butadiene prepolymer in the novelthermosetting resin composition of a semi-IPN composite of the presentinvention is produced by preliminarily-reacting the component (B) withthe component (C) in the presence of the component (A), that ispreferably spread in a medium, to the extent that gelation does notoccur. Then, there is formed a semi-IPN polymer in which molecularchains are physically entangled with each other in a system of thecomponent (A), component (B) and component (C), which is originally animmiscible system, and a prepolymer that is homogeneous in the externalappearance (compatibilized) is obtained in an uncured state which is astage before the completely cured state.

According to the present invention, the prepolymer can be produced by,for example, spreading the component (A) in a medium by dissolving thecomponent (A) in a solvent or the like, subsequently dissolving ordispersing the component (B) and the component (C) in this solution, andheating and stirring the resultant at 60 to 170° C. for 0.1 to 20 hours.In the case of producing polyphenylene ether-modified butadieneprepolymer in a solution, it is preferable to adjust the amount of useof the solvent so that the concentration of solids (involatile fraction)in the solution reaches typically 5 to 80% by weight. Then, afterproducing the polyphenylene ether-modified butadiene prepolymer, thesolvent may be completely removed by concentration or the like to obtaina solventless resin composition, or the prepolymer may be directlydissolved or dispersed in a solvent to obtain a polyphenyleneether-modified butadiene prepolymer solution. Also, in the case ofpreparing a solution, the solution may have the concentration of solids(involatile fraction) increased by concentration or the like.

The mixing proportions of the component (A), component (B) and component(C) used in the production of polyphenylene ether-modified butadieneprepolymer, in the resin composition of the present invention, aredetermined such that the mixing proportion of the component (A) is inthe range of 2 to 200 parts by weight, more preferably 10 to 100 partsby weight, and even more preferably 15 to 50 parts by weight, based on100 parts by weight of the total amount of the component (B) and thecomponent (C). The mixing proportion of the component (A) is preferablymixed based on 100 parts by weight of the total amount of the component(B) and the component (C), in consideration of the balance between thecoating workability attributable to thermal expansion coefficient,dielectric properties, and the viscosity of the resin varnish, and themolding property in the case of using the resin composition in printedcircuit boards, which is attributable to the melt viscosity obtainedwhen the resin composition is used in prepregs. Furthermore, the mixingproportion of the component (C) is preferably in the range of 2 to 200parts by weight, more preferably 5 to 100 parts by weight, and even morepreferably 10 to 75 parts by weight, based on 100 parts by weight of thecomponent (B). The mixing proportion of the component (C) is preferablymixed based on 100 parts by weight of the component (B), inconsideration of the balance between thermal expansion coefficient, Tgand metal foil peeling strength, and the dielectric properties.

The polyphenylene ether-modified butadiene prepolymer of the presentinvention is obtained by preliminarily-reacting the components so that aconversion rate (reaction rate) of the component (C) falls in the rangeof 5 to 100% during the production of the prepolymer. A more preferredrange may vary with the mixing proportions of the component (B) and thecomponent (C). Thus, when the mixing proportion of the component (C) isin the range of 2 to 10 parts by weight based on 100 parts by weight ofthe component (B), the conversion rate (reaction rate) of the component(C) is more preferably in the range of 10 to 100%; when the mixingproportion is in the range of 10 to 100 parts by weight, the conversionrate (reaction rate) of the component (C) is more preferably in therange of 7 to 90%; and when the proportion is in the range of 100 to 200parts by weight, the conversion rate (reaction rate) of the component(C) is more preferably in the range of 5 to 80%. The conversion rate(reaction rate) of the component (C) is preferably 5% or more, from theviewpoints of uniform external appearance and non-tackiness in the caseof a resin composition or a prepreg, and from the viewpoint of heatresistance after moisture absorption, metal foil peeling strength orthermal expansion coefficient in the case of a printed circuit board.

In addition, the polyphenylene ether-modified butadiene prepolymeraccording to the present invention includes a state in which thecomponent (C) is 100% converted. The prepolymer also includes a state inwhich a conversion of the component (C) is less than 100%, andunreacted, unconverted component (C) is remaining.

The conversion rate (reaction rate) of the component (C) is a valuecalculated on the basis of the residual amount of the component (C) inthe polyphenylene ether-modified butadiene prepolymer measured by gelpermeation chromatography, and a calibration curve for the component (C)constructed in advance.

It is preferable, for the purpose of initiating or accelerating thepreliminary reaction between the component (B) and the component (C)during the production of polyphenylene ether-modified butadieneprepolymer, and for the purpose of initiating or accelerating the curingreaction of the resin composition during the production of metal cladlaminated boards or multilayer printed circuit boards, that the resincomposition of the present invention contains (D) a radical reactioninitiator.

Specific examples of the component (D) include, but not limited to,peroxides such as dicumyl peroxide, t-butylcumyl peroxide, benzoylperoxide, cumene hydroperoxide,1,1-bis(t-hexylperoxy)-3,3,5-trimethylcyclohexane,1,1-bis(t-butylperoxy)-2-methylcyclohexane,1,1-bis(t-hexylperoxy)cyclohexane, 1,1-bis(t-butylperoxy)cyclohexane,2,2-bis(4,4-di(t-butylperoxy)cyclohexyl)propane,2,5-dimethylhexane-2,5-dihydroperoxide,2,5-dimethyl-2,5-bis(t-butylperoxy)hexyne-3, di-t-butylperoxide,1,1′-bis(t-butylperoxy)diisopropylbenzene,2,5-dimethyl-2,5-bis(t-butylperoxy)hexane, di-t-butylperoxyisophthalate, t-butyl peroxybenzoate, t-butyl peroxyacetate,2,2-bis(t-butylperoxy)butane, 2,2-bis(t-butylperoxy)octane,2,5-dimethyl-2,5-di(benzoylperoxy)hexane,bis(t-butylperoxy)isophthalate, isobutyryl peroxide, di(trimethylsilyl)peroxide and trimethylsilyl triphenylsilyl peroxide;2-hydroxy-2-methyl-1-phenylpropan-1-one,1-(4-isopropylphenyl)-2-hydroxy-2-methylpropan-1-one, benzoin methylether, methyl-O-benzoyl benzoate, and the like.

It is also preferable for the component (D) to incorporate those usedfor the purpose of initiating or accelerating the preliminary reactionduring the production of polyphenylene ether-modified butadieneprepolymer, and those used for the purpose of initiating or acceleratingthe curing reaction after the production of polyphenylene ether-modifiedbutadiene prepolymer, in divided portions before and after theproduction of the polyphenylene ether-modified butadiene prepolymer. Inthat case, for the component (D) incorporated for each of the purposes,compounds of the same type may be used, or compounds of different typesmay be used. Also, a single species may be used individually alone, or amixture of two or more species may be used.

The mixing proportion of the component (D) in the resin composition ofthe present invention can be determined in accordance with the mixingproportions of the component (B) and the component (C), and ispreferably 0.05 to 10 parts by weight based on 100 parts by weight ofthe total amount of the component (B) and the component (C). When theradical reaction initiator of the component (D) is incorporated withinthis value range, an appropriate reaction speed is obtained for thepreliminary reaction during the production of the polyphenyleneether-modified butadiene prepolymer, and good curability is obtained forthe curing reaction during the production of metal clad laminated boardsor multilayer printed circuit boards.

Furthermore, the resin composition of the present invention may befurther incorporated with, if necessary, (E) a crosslinkable monomer orcrosslinkable polymer containing one or more groups having anethylenically unsaturated double bond in the molecule, which does notconstitute uncured semi-IPN composite; (F) a flame retardant; (G) aninorganic filler; and various thermosetting resins; variousthermoplastic resins; and various additives. The mixing amounts of thesematerials are preferably set within the range of not deteriorating theproperties such as the dielectric properties, heat resistance,adhesiveness (metal foil peeling strength, adhesiveness to substrates ofglass and the like), moisture resistance, Tg and thermal expansionproperties when the resin composition is used in printed circuit boards.

The crosslinkable monomer or crosslinkable polymer containing one ormore groups having an ethylenically unsaturated double bond in themolecule, which does not constitute uncured semi-IPN composite of thecomponent (E) is not particularly limited. Specifically, thecrosslinkable monomer or crosslinkable polymer is selected from thegroup consisting of chemically unmodified butadiene polymers, maleimidecompounds and styrene-butadiene copolymers. The compounds mentioned asthe component (B) and the component (C) can be used, as long as they donot constitute uncured semi-IPN composite. Furthermore, as thechemically unmodified butadiene polymer, there may be mentioned abutadiene polymer which has a number average molecular weight of greaterthan 10,000, and is not chemically modified. These compounds may be usedindividually alone, or may be used as mixtures of two or more species.

In the case where the same compounds as those mentioned as the component(B) and the component (C) are incorporated as the component (E), thecompounds are incorporated after the production of the thermosettingresin composition of an uncured semi-IPN composite (polyphenyleneether-modified butadiene prepolymer), and the mixing amount of thecomponent (E) in that case is distinguished from the mixing amounts ofthe component (B) and component (C), and preferred mixing amountsthereof are separately described below. In the case where the samecompounds as those mentioned as the component (B) and component (C) areincorporated as the component (E), the same species as those used in theproduction of the polyphenylene ether-modified butadiene prepolymer maybe used, or compounds of different kinds may also be used.

In the case of incorporating a styrene-butadiene copolymer as thecomponent (E), the copolymer can be used in the form of rubber as wellas in the form of elastomer, and the copolymer is not particularlylimited in terms of the molecular weight, copolymerization ratio ofstyrene and butadiene, and the ratio of 1,2-vinyl bond and the ratio of1,4-bond in the butadiene unit. Furthermore, in the case ofincorporating, as the component (E), a butadiene polymer which has anumber average molecular weight of greater than 10,000 and is notchemically modified, the polymer can be used in the form of liquid aswell as in the form of solid, and also is not particularly limited interms of the ratio of 1,2-vinyl bond and the ratio of 1,4-bond.

The mixing proportion of the component (E) in the resin composition ofthe present invention is not particularly limited, but is preferably 2to 100 parts by weight, more preferably 2 to 80 parts by weight, andeven more preferably 2 to 60 parts by weight, based on 100 parts byweight of the total amount of the component (A), component (B) andcomponent (C).

The flame retardant of the component (F) is not particularly limited,but bromine-based, phosphorus-based, and metal hydroxide-based flameretardants, and the like are suitably used. More specifically, examplesof the bromine-based flame retardants include brominated epoxy resinssuch as brominated bisphenol A epoxy resins and brominated phenolnovolac epoxy resins; brominated addition type flame retardants such ashexabromobenzene, pentabromotoluene, ethylenebis(pentabromophenyl),ethylenebistetrabromophthalimide,1,2-dibromo-4-(1,2-dibromoethyl)cyclohexane, tetrabromocyclooctane,hexabromocyclododecane, bis(tribromophenoxy)ethane, brominatedpolyphenylene ether, brominated polystyrene and2,4,6-tris(tribromophenoxy)-1,3,5-triazine; brominated reactive flameretardants containing a group having an unsaturated double bond, such astribromophenylmaleimide, tribromophenyl acrylate, tribromophenylmethacrylate, tetrabromobisphenol A dimethacrylate, pentabromobenzylacrylate and styrene bromide; and the like.

Examples of the phosphorus-based flamed retardants include aromaticphosphoric acid esters such as triphenyl phosphate, tricresyl phosphate,trixylenyl phosphate, cresyl diphenyl phosphate, cresyl di-2,6-xylenylphosphate and resorcinol bis(diphenyl phosphate); phosphoric acid esterssuch as divinyl phenylphosphonate, diallyl phenylphosphonate andbis(1-butenyl)phenylphosphonate; phosphinic acid esters such as phenyldiphenylphosphinate, methyl diphenylphosphinate,9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide derivatives;phosphagen compounds such as bis(2-allylphenoxy)phosphagen,dicresylphosphagen; and phosphorus-based flame retardants such asmelamine phosphate, melamine pyrrolate, melamine polyphosphate, melampolyphosphate, ammonium polyphosphate, phosphorus-containing vinylbenzylcompounds and red phosphorus. Examples of the metal hydroxide flameretardants include magnesium hydroxide, aluminum hydroxide and the like.The above-mentioned flame retardants may be used individually alone, ormay also be used in combination of two or more species.

The mixing proportion of the component (F) in the resin composition ofthe present invention is not particularly limited, but is preferably 5to 200 parts by weight, more preferably 5 to 150 parts by weight, andeven more preferably 5 to 100 parts by weight, based on 100 parts byweight of the total amount of the component (A), component (B) andcomponent (C). If the mixing proportion of the flame retardant is lessthan 5 parts by weight, flame resistance tends to be insufficient. Ifthe mixing proportion exceeds 200 parts by weight, heat resistance ormetal foil peeling strength tends to decrease when the resin compositionis used in printed circuit boards.

The inorganic filler of the component (G) is not particularly limited,but specifically, alumina, titanium oxide, mica, silica, beryllia,barium titanate, potassium titanate, strontium titanate, calciumtitanate, aluminum carbonate, magnesium hydroxide, aluminum hydroxide,aluminum silicate, calcium carbonate, calcium silicate, magnesiumsilicate, silicon nitride, boron nitride, clay such as calcined clay,talc, aluminum borate, aluminum borate, silicon carbide and the like areused. These inorganic fillers may be used alone, or may also be used incombination of two or more species. The shape and particle size of theinorganic filler also are not particularly limited, and those having aparticle size of typically 0.01 to 50 μm, and preferably 0.1 to 15 μm,are suitably used.

The mixing proportion of the component (G) in the resin composition ofthe present invention is not particularly limited, but is preferably 1to 1000 parts by weight, and more preferably 5 to 500 parts by weight,based on 100 parts by weight of the total amount of the component (A),component (B) and component (C).

According to the present invention, the solvent is not particularlylimited, but specific examples thereof include alcohols such asmethanol, ethanol and butanol; ethers such as ethyl cellosolve, butylcellosolve, ethylene glycol monomethyl ether, carbitol and butylcarbitol; ketones such as acetone, methyl ethyl ketone, methyl isobutylketone and cyclohexanone; aromatic hydrocarbons such as toluene, xyleneand mesitylene; esters such as methoxyethyl acetate, ethoxyethylacetate, butoxyethyl acetate and ethyl acetate; nitrogen-containingsolvents such as N,N-dimethylformamide, N,N-dimethylacetamide andN-methyl-2-pyrrolidone; and the like. These may be used individuallyalone, or may also be used in combination of two or more species.Aromatic hydrocarbons such as toluene, xylene and mesitylene, or solventmixtures of aromatic hydrocarbons and ketones such as acetone, methylethyl ketone, methyl isobutyl ketone and cyclohexanone, are morepreferred. In the case of using a solvent mixture of aromatichydrocarbons and ketones among these solvents, the mixing proportion ofthe ketone is preferably 5 to 100 parts by weight, more preferably 10 to80 parts by weight, and even more preferably 15 to 60 parts by weight,based on 100 parts by weight of the aromatic hydrocarbon.

Furthermore, the various thermosetting resins incorporated into theresin composition of the present invention as necessary are notparticularly limited, but specific examples thereof include epoxyresins, cyanate ester resins, phenol resins, urethane resins, melamineresins, benzoxazine resins, benzocyclobutene resins, dicyclopentadieneresins and the like. Their curing agents or curing accelerating agentsmay also be used. The various thermoplastic resins incorporated asnecessary are not particularly limited, but specific examples thereofinclude polyolefins such as polyethylene, polypropylene, polybutene,ethylene-propylene copolymers and poly(4-methylpentene), and derivativesthereof; polyesters and derivatives thereof; polycarbonates,polyacetals, polysulfones, (meth)acrylic acid ester copolymers,polystyrene, acrylonitrile styrene copolymers, acrylonitrile styrenebutadiene copolymers, polyvinyl acetals, polyvinyl butyrals, polyvinylalcohols; full or partial hydrogenation products of styrene-butadienecopolymers; full or partial hydrogenation products of polybutadiene;liquid crystalline polymers such as polyether sulfones, polyetherketones, polyether imides, polyphenylene sulfite, polyamideimide,polyamides, thermoplastic polyimides and aromatic polyesters; and thelike. The various additives are not particularly limited, but specificexamples thereof include silane coupling agents, titanate couplingagents, antioxidants, thermal stabilizers, antistatic agents,ultraviolet absorbents, pigments, colorants, lubricants and the like.These various thermosetting resins, various thermoplastic resins andvarious additives may be respectively used individually, or may also beused in combination of two or more species.

As one method for producing the resin composition of the presentinvention, a polyphenylene ether-modified butadiene prepolymer obtainedfrom the component (A), component (B) and component (C); (D) a radicalreaction initiator; and (E) a crosslinkable monomer or crosslinkablepolymer which contains one or more groups having an ethylenicallyunsaturated double bond in the molecule, and does not constitute uncuredsemi-IPN composite; (F) a flame retardant; (G) an inorganic filler,which are optionally incorporated; and various thermosetting resins,various thermoplastic resins; and various additives are incorporated,stirred and mixed by a known method, to produce the resin composition.

The resin varnish can be obtained by dissolving or dispersing theabove-described resin composition of the present invention in a solvent.Further, when the polyphenylene ether-modified butadiene prepolymer isproduced in a solution, first, the solvent may be removed, and thesolventless polyphenylene ether-modified butadiene prepolymer and theabove-described other agents to be incorporated may be dissolved ordispersed in a solvent to obtain a resin varnish. A resin varnish mayalso be obtained by further incorporating the component (D), andoptionally, the component (E), component (F), component (G) and theabove-described other agents to be incorporated, and if necessary,additional solvent, to the polyphenylene ether-modified butadieneprepolymer solution.

The solvent used in preparing the above-described resin composition intoa varnish is not particularly limited, but as specific examples orpreferred examples of the solvent, those described with regard to thesolvent used in the production of the polyphenylene ether-modifiedbutadiene prepolymer can be used. These may be used individually alone,or may also be used in combination of two or more species. Aromatichydrocarbons such as toluene, xylene and mesitylene, or solvent mixturesof the aromatic hydrocarbons and ketones such as acetone, methyl ethylketone, methyl isobutyl ketone and cyclohexanone, are more preferred. Inaddition, the solvent used in varnish preparation may be of the sametype as the solvents used in the production of the polyphenyleneether-modified butadiene prepolymer, or may also be solvents ofdifferent types.

At the time of preparing a varnish, it is preferable to adjust theamount of use of the solvent such that the concentration of solids(involatile fraction) in the varnish reaches 5 to 80% by weight.However, by adjusting the amount of solvent during the production of aprepreg or the like using the resin varnish of the present invention,preparation can be achieved to reach a concentration of solids(involatile fraction) or varnish viscosity that is optimum for coatingoperation (for example, to achieve good external appearance and anappropriate amount of applied resin).

The prepreg or metal clad laminated board of the present invention canbe produced by a known method, using the above-described resincomposition and resin varnish of the present invention. For example, theprepreg is obtained by impregnating the thermosetting resin compositionand resin varnish of the present invention into a reinforced fibersubstrate such as glass fiber or organic fiber, and then drying theresultant in a drying oven or the like, typically at a temperature of 60to 200° C., and preferably 80 to 170° C., for 2 to 30 minutes, andpreferably for 3 to 15 minutes. Subsequently, one sheet or multiplesheets of this prepreg are stacked, metal foil is disposed on one sideor both sides of the stacked prepreg, and the assembly is heated and/orpressed under predetermined conditions. Thus, a double-sided orsingle-sided metal clad laminated board may be obtained. Heating in thiscase can be performed preferably in the temperature range of 100° C. to250° C., while pressing can be performed preferably in the pressurerange of 0.5 to 10.0 MPa. It is preferable to perform heating andpressing simultaneously using a vacuum press or the like, and in thiscase, these treatments are preferably performed for 30 minutes to 10hours. Furthermore, when circuit formation processing by means ofperforation processing, metal plating processing, metal foil etching orthe like, and multilayer adhesion processing are performed according toknown methods, using the prepreg or metal clad laminated board producedas described above, a single-sided, double-sided or multilayer printedcircuit board may be obtained.

The present invention is not limited to the above-described forms oraspects, and any alterations and modifications can be carried out withinthe scope of not deviating from the purpose of the invention.

EXAMPLES

Hereinafter, the present invention will be described in more detail byway of Examples, but the present invention is not intended to be limitedto these Examples.

Preparation of Resin Varnish (Resin Composition) Preparation Example 1

To a one-liter separable flask equipped with a thermometer, a refluxcondenser, a lowered pressure concentration apparatus and a stirringapparatus, 350 parts by weight of toluene and 50 parts by weight ofpolyphenylene ether (S202A, manufactured by Asahi Kasei ChemicalsCorporation, Mn: 16,000) as the component (A) were introduced, thetemperature inside the flask was set to 90° C., and the contents weredissolved while stirring. Then, 100 parts by weight of a chemicallyunmodified butadiene polymer (B-3000, manufactured by Nippon Soda Co.,Ltd., Mn: 3000, 1,2-vinyl structure: 90%) as the component (B) and 30parts by weight of bis(4-maleimidophenyl)methane (BMI-1000, manufacturedby Daiwa Fine Chemicals Co., Ltd.) as the component (C) were introduced,and methyl isobutyl ketone (MIBK) was introduced as a solvent so thatthe concentration of solids (involatile fraction) in the solution wasmade to reach 30% by weight. The mixture was continuously stirred, andit was confirmed that the contents were dissolved or uniformlydispersed. Thereafter, the temperature of the liquid was raised to 110°C. While maintaining the temperature at 110° C., 0.5 parts by weight of1,1-bis(t-hexylperoxy)-3,3,5-trimethylcyclohexane (Perhexa TMH,manufactured by NOF Corporation) was incorporated as a reactioninitiator. The mixture was subjected to a preliminary reaction for aboutone hour while stirring, to obtain a polyphenylene ether-modifiedbutadiene prepolymer solution in which the (A) polyphenylene ether, (B)chemically unmodified butadiene polymer and (C) crosslinking agent werecompatibilized. The conversion rate of bis(4-maleimidophenyl)methane inthis polyphenylene ether-modified butadiene prepolymer solution wasmeasured using gel permeation chromatography (GPC). The conversion ratewas 33%. The conversion rate is a value obtained by subtracting theunconverted fraction (measured value) of bis(4-maleimidophenyl)methanefrom 100.

Subsequently, the temperature of the liquid in the flask was set at 80°C. Thereafter, the solution was concentrated while stirring, so that thesolid concentration in the solution was made to reach 45% by weight.Then, the solution was cooled to room temperature. Subsequently, 5 partsby weight of 1,1′-bis(t-butylperoxy)diisopropylbenzene (Perbutyl P,manufactured by NOF Corporation) was added as the component (D). Then,methyl ethyl ketone (MEK) was incorporated to prepare a resin varnish ofPreparation Example 1 (solid concentration: about 40% by weight).

Preparation Example 2

A polyphenylene ether-modified butadiene prepolymer was obtained in thesame manner as in Preparation Example 1, except that 30 parts by weightof polyphenylmethanemaleimide (BMI-2000, manufactured by Daiwa FineChemicals Co., Ltd.) was used instead of thebis(4-maleimidophenyl)methane used as the component (C) in PreparationExample 1. The conversion rate of BMI-2000 in this polyphenyleneether-modified butadiene prepolymer solution was measured using GPC. Theconversion rate was 35%.

Subsequently, a resin varnish of Preparation Example 2 (solidconcentration: about 40% by weight) was prepared using this solution, inthe same manner as in Preparation Example 1.

Preparation Example 3

A polyphenylene ether-modified butadiene prepolymer was obtained in thesame manner as in Preparation Example 1, except that 35 parts by weightof bis(3-ethyl-5-methyl-4-maleimidophenyl)methane (BMI-5100,manufactured by Daiwa Fine Chemicals Co., Ltd.) was used instead of thebis(4-maleimidophenyl)methane used as the component (C) in PreparationExample 1. The conversion rate of BMI-5100 in this polyphenyleneether-modified butadiene prepolymer solution was measured using GPC. Theconversion rate was 25%. Subsequently, a resin varnish of PreparationExample 3 (solid concentration: about 40% by weight) was prepared usingthis solution, in the same manner as in Preparation Example 1.

Preparation Example 4

A polyphenylene ether-modified butadiene prepolymer was obtained in thesame manner as in Preparation Example 1, except that 40 parts by weightof 2,2-bis(4-(4-maleimidophenoxy)phenyl)propane (BMI-4000, manufacturedby Daiwa Fine Chemicals Co., Ltd.) was used instead of thebis(4-maleimidophenyl)methane used as the component (C) in PreparationExample 1. The conversion rate of BMI-4000 in this polyphenyleneether-modified butadiene prepolymer solution was measured using GPC. Theconversion rate was 30%. Subsequently, a resin varnish of PreparationExample (solid concentration: about 40% by weight) was prepared usingthis solution, in the same manner as in Preparation Example 1.

Preparation Example 5

(a) A polyphenylene ether-modified butadiene prepolymer was obtained inthe same manner as in Preparation Example 1, except that 15 parts byweight of N-phenylmaleimide (Imilex-P, manufactured by Nippon ShokubaiCo., Ltd.) was used instead of the bis(4-maleimidophenyl)methane used asthe component (C) in Preparation Example 1. The conversion rate ofImilex-P in this polyphenylene ether-modified butadiene prepolymersolution was measured using GPC. The conversion rate was 26%.

(b) Subsequently, this solution was concentrated in the same manner asin Preparation Example 1, and then, while maintaining the liquidtemperature at 80° C., 25 parts by weight of2,2-bis(4-(4-maleimidophenoxy)phenyl)propane (BMI-4000, manufactured byDaiwa Fine Chemicals Co., Ltd.) was incorporated therein as thecomponent (E). Then, after cooling the system to room temperature whilestirring, 5 parts by weight of 1,1′-bis(t-butylperoxy)diisopropylbenzene (Perbutyl-P, manufactured by NOF Corporation) wasadded as the component (D). Then, methyl ethyl ketone (MEK) wasincorporated to prepare a resin varnish of Preparation Example 5 (solidconcentration: about 40% by weight).

Preparation Example 6

A polyphenylene ether-modified butadiene prepolymer was obtained in thesame manner as in Preparation Example 5, except that 15 parts by weightof bis(4-maleimidophenyl)methane (BMI-1000, manufactured by Daiwa FineChemicals Co., Ltd.) was used instead of the N-phenylmaleimide used asthe component (C) in Preparation Example 5(a). The conversion rate ofBMI-1000 in this polyphenylene ether-modified butadiene prepolymersolution was measured using GPC. The conversion rate was 32%.

Subsequently, a resin varnish of Preparation Example 6 (solidconcentration: about 40% by weight) was prepared using this solution, inthe same manner as in Preparation Example 5(b).

Preparation Example 7

(a) A polyphenylene ether-modified butadiene prepolymer was obtained inthe same manner as in Preparation Example 5, except that 25 parts byweight of 2,2-bis(4-(4-maleimidophenoxy)phenyl)propane (BMI-4000,manufactured by Daiwa Fine Chemicals Co., Ltd.) was used instead of theN-phenylmaleimide used as the component (C) in Preparation Example 5(a).The conversion rate of BMI-4000 in this polyphenylene ether-modifiedbutadiene prepolymer solution was measured using GPC. The conversionrate was 31%.

(b) Subsequently, using this solution, a resin varnish of PreparationExample 7 (solid concentration: about 40% by weight) was prepared in thesame manner as in Preparation Example 5, except that 15 parts by weightof bis(3-ethyl-5-methyl-4-maleimidophenyl)methane (BMI-5100,manufactured by Daiwa Fine Chemicals Co., Ltd.) was used instead of the2,2-bis(4-(4-maleimidophenoxy)phenyl)propane used as the component (E)in Preparation Example 5(b), and 70 parts by weight ofethylenebis(pentabromophenyl) (SAYTEX8010, manufactured by AlbemarleCorporation) was incorporated as the component (F).

Preparation Example 8

A polyphenylene ether-modified butadiene prepolymer was obtained in thesame manner as in Preparation Example 7, except that the mixing amountof 2,2-bis(4-(4-maleimidophenoxy)phenyl)propane (BMI-4000, manufacturedby Daiwa Fine Chemicals Co., Ltd.) used as the component (C) inPreparation Example 7(a) was changed to 40 parts by weight. Theconversion rate of BMI-4000 in this polyphenylene ether-modifiedbutadiene prepolymer solution was measured using GPC. The conversionrate was 30%.

Subsequently, using this solution, a resin varnish of PreparationExample 8 (solid concentration: about 40% by weight) was prepared in thesame manner as in Preparation Example 7, except that 10 parts by weightof a styrene-butadiene copolymer (Tufprene 125, Asahi Kasei ChemicalsCorp.) was incorporated instead of thebis(3-ethyl-5-methyl-4-maleimidophenyl)methane used as the component (E)in Preparation Example 7(b), and 70 parts by weight ofethylenebistetrabromophthalimide (BT-93W, manufactured by AlbemarleCorporation) was incorporated instead of ethylenebis(pentabromophenyl).

Preparation Example 9

(a) A polyphenylene ether-modified butadiene prepolymer was obtained inthe same manner as in Preparation Example 1, except that 20 parts byweight of divinylbiphenyl (Nippon Steel Chemical Co., Ltd.) was usedinstead of the bis(4-maleimidophenyl)methane used as the component (C)in Preparation Example 1. The conversion rate of divinylbiphenyl in thispolyphenylene ether-modified butadiene prepolymer solution was measuredusing GPC. The conversion rate was 28%.

(b) Subsequently, this solution was concentrated in the same manner asin Preparation Example 1, and then while maintaining the liquidtemperature at 80° C., 70 parts by weight of brominated polystyrene(PBS64HW, manufactured by Great Lakes Chemical Corp.) was incorporatedas the component (F). Then, after cooling the system to room temperaturewhile stirring, 5 parts by weight of1,1′-bis(t-butylperoxy)diisopropylbenzene (Perbutyl P, manufactured byNOF Corporation) was added as the component (D), and then methyl ethylketone (MEK) was incorporated to prepare a resin varnish of PreparationExample 9 (solid concentration: about 40% by weight).

Preparation Example 10

To a resin varnish prepared in the same manner as in Preparation Example3 (conversion rate of BMI-5100 in the polyphenylene ether-modifiedbutadiene prepolymer solution was 24%), 35 parts by weight of sphericalsilica (SO-25R, average particle size: 0.5 μm, manufactured by AdmatexCo., Ltd.) was incorporated as the inorganic filler of the component(G), and then methyl ethyl ketone (MEK) was incorporated to prepare aresin varnish of Preparation Example 10 (solid concentration: about 45%by weight).

Preparation Example 11

A polyphenylene ether-modified butadiene prepolymer was obtained in thesame manner as in Preparation Example 3, except that Ricon142(manufactured by Sartomer Corp., Mn: 3900, 1,2-vinyl structure: 55%) wasused instead of B-3000 as the chemically unmodified butadiene polymer ofthe component (B) in Preparation Example 3. The conversion rate ofBMI-5100 in this polyphenylene ether-modified butadiene prepolymersolution was measured using GPC. The conversion rate was 27%.Subsequently, using this solution, a resin varnish of PreparationExample 11 (solid concentration: about 40% by weight) was prepared inthe same manner as in Preparation Example 3.

Comparative Preparation Example 1

To a one-liter separable flask equipped with a thermometer, a refluxcondenser and a stirring apparatus, 200 parts by weight of toluene and50 parts by weight of polyphenylene ether (S202A, manufactured by AsahiKasei Chemicals Corp., Mn: 16,000) were introduced, the temperatureinside the flask was set at 90° C., and the contents were dissolved withstirring. Subsequently, 100 parts by weight of triallyl isocyanurate(TRIC, manufactured by Nippon Kasei Chemical Co., Ltd.) was introduced,it was confirmed that the contents were dissolved or uniformlydispersed, and then the system was cooled to room temperature. Then,after cooling the system to room temperature while stirring, 5 parts byweight of 1,1′-bis(t-butylperoxy)diisopropylbenzene (Perbutyl P,manufactured by NOF Corporation) was added as a reaction initiator, andthen methyl ethyl ketone (MEK) was incorporated to prepare a resinvarnish of Comparative Preparation Example 1 (solid concentration: about40% by weight).

Comparative Preparation Example 2

A resin varnish of Comparative Preparation Example (solid concentration:about 40% by weight) was prepared in the same manner as in ComparativePreparation Example 1, except that 100 parts by weight ofbis(3-ethyl-5-methyl-4-maleimidophenyl)methane (BMI-5100, manufacturedby Daiwa Fine Chemicals Co., Ltd.) was used instead of the triallylisocyanurate used in Comparative Preparation Example 1.

Comparative Preparation Example 3

A resin varnish of Comparative Preparation Example 3 (solidconcentration: about 40% by weight) was prepared in the same manner asin Comparative Preparation Example 1, except that 100 parts by weight ofa chemically unmodified butadiene polymer (B-3000, manufactured byNippon Soda Co., Ltd., Mn: 3000, 1,2-vinyl structure: 90%) was usedinstead of the triallyl isocyanurate used in Comparative PreparationExample 1.

Comparative Preparation Example 4

A resin varnish of Comparative Preparation Example 4 (solidconcentration: about 40% by weight) was prepared in the same manner asin Comparative Preparation Example 3, except that 50 parts by weight oftriallyl isocyanurate (TRIC, manufactured by Nippon Kasei Chemical Co.,Ltd.) was further added compared to Comparative Preparation Example 3.

Comparative Preparation Example 5

A resin varnish of Comparative Preparation Example 5 (solidconcentration: about 40% by weight) was prepared in the same manner asin Comparative Preparation Example 4, except that 30 parts by weight ofbis(4-maleimidophenyl)methane (BMI-1000, manufactured by Daiwa FineChemicals Co., Ltd.) was used instead of the triallyl isocyanurate usedin Comparative Preparation Example 4.

Comparative Preparation Example 6

To a one-liter separable flask equipped with a thermometer, a refluxcondenser, a lowered pressure concentrating apparatus and a stirringapparatus, 350 parts by weight of toluene and 50 parts by weight ofpolyphenylene ether (S202A, manufactured by Asahi Kasei Chemicals,Corp., Mn: 16,000) were introduced, the temperature inside the flask wasset at 90° C., and the contents were dissolved with stirring.Subsequently, 100 parts by weight of glycol-modified 1,2-polybutadienehaving hydroxyl groups at the ends (G-3000, manufactured by Nippon SodaCo., Ltd., Mn: 3000, 1,2-vinyl structure: 90%) and 30 parts by weight ofbis(4-maleimidophenyl)methane (BMI-1000, manufactured by Daiwa FineChemicals Co., Ltd.) were introduced, and methyl isobutyl ketone (MIBK)was introduced so that the concentration of solids (involatile fraction)in the solution was made to reach 30% by weight. It was confirmed thatthe contents were dissolved or uniformly dispersed, and then whilemaintaining the liquid temperature at 110° C., 0.5 parts by weight of1,1-bis(t-hexylperoxy)-3,3,5-trimethylcyclohexane (Perhexa TMH,manufactured by NOF Corporation) was incorporated as a reactioninitiator. The contents were subjected to a preliminary reaction forabout 10 minutes while stirring. The conversion rate of BMI-1000 in thispreliminarily reaction product was measured using GPC. The conversionrate was 4%. Subsequently, the liquid temperature in the flask was setat 80° C., and then the solution was concentrated while stirring, sothat the concentration of solids (involatile fraction) of the solutionwas made to reach 45% by weight. Then, the solution was cooled to roomtemperature. Thereafter, 5 parts by weight of1,1′-bis(t-butylperoxy)diisopropylbenzene (Perbutyl P, manufactured byNOF Corporation) was added as a reaction initiator, and then methylethyl ketone (MEK) was incorporated to prepare a resin varnish ofComparative Preparation Example 6 (solid concentration: about 40% byweight).

Comparative Preparation Example 7

A preliminary reaction product was obtained in the same manner as inComparative Preparation Example 6, except that 100 parts by weight ofcarboxylic acid-modified 1,2-polybutadiene having carboxyl groups at theends (C-1000, manufactured by Nippon Soda Co., Ltd., Mn: 1400, 1,2-vinylstructure: 89%) was used instead of the glycol-modified1,2-polybutadiene used in Comparative Preparation Example 6. Theconversion rate of BMI-1000 in this preliminary reaction product wasmeasured using GPC. The conversion rate was 19%. Subsequently, usingthis solution, a resin varnish of Comparative Preparation Example 7(solid concentration: about 40% by weight) was prepared in the samemanner as in Comparative Preparation Example 6.

Comparative Preparation Example 8

A preliminary reaction product of polybutadiene was obtained in thepresence of polyphenylene ether in the same manner as in PreparationExample 1, except that Ricon130 (manufactured by Sartomer Corp., Mn:2500, 1,2-vinyl structure: 28%) was used instead of B-3000 as thebutadiene homopolymer used in Preparation Example 1. The conversion rateof BMI-1000 in this preliminary reaction product was measured using GPC.The conversion rate was 24%. Subsequently, using this solution, a resinvarnish of Comparative Preparation Example 8 (solid concentration: about40% by weight) was prepared in the same manner as in Preparation Example1.

The amounts of use of the various raw materials used in the preparationof the resin varnishes (curable resin compositions) of PreparationExamples 1 to 11 and Comparative Preparation Examples 1 to 8 aresummarized and shown in Table 1.

TABLE 1 Preparation Example 1 2 3 4 5 6 7 8 9 10 11 Polyphenylene ether50 50 50 50 50 50 50 50 50 50 50 Butadiene homopolymer 100 100 100 100100 100 100 100 100 100 100 Glycol-modified polybutadiene — — — — — — —— — — — Carboxylic acid-modified polybutadiene — — — — — — — — — — —Crosslinking agent BMI-1000 30 — — — — 15 — — — — — BMI-2000 — 30 — — —— — — — — — BMI-5100 — — 35 — — — 15 — — 35 35 BMI-4000 — — — 40 25 2525 40 — — — Imilex-P — — — — 15 — — — — — — Divinylbiphenyl — — — — — —— — 20 — — TAIC — — — — — — — — — — — Reaction initiator Perhexa TMH 0.50.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 Perbutyl P 5 5 5 5 5 5 5 5 5 5 5Flame retardant SAYTEX8010 — — — — — — 70 — — — — BT-93W — — — — — — —70 — — — PBS64HW — — — — — — — — 70 — — Styrene-butadiene copolymer — —— — — — — 10 — — — Inorganic filler SO-25R — — — — — — — — — 35 —Comparative Preparation Example 1 2 3 4 5 6 7 8 Polyphenylene ether 5050 50 50 50 50 50 50 Butadiene homopolymer — — 100 100 100 — — 100Glycol-modified polybutadiene — — — — — 100 — — Carboxylic acid-modifiedpolybutadiene — — — — — — 100 — Crosslinking agent BMI-1000 — — — — 3030 30 30 BMI-2000 — — — — — — — — BMI-5100 — 100 — — — — — — BMI-4000 —— — — — — — — Imilex-P — — — — — — — — Divinylbiphenyl — — — — — — — —TAIC 100 — — 50 — — — — Reaction initiator Perhexa TMH — — — — — 0.5 0.50.5 Perbutyl P 5 5 5 5 5 5 5 5 Flame retardant SAYTEX8010 — — — — — — —— BT-93W — — — — — — — — PBS64HW — — — — — — — — Styrene-butadienecopolymer — — — — — — — — Inorganic filler SO-25R — — — — — — — —(Mixing in parts by weight)

The abbreviations in the table have the following meanings.

BMI: Bismaleimide compound

Imilex P: N-phenylmaleimide

TRIC: Triallyl isocyanurate

Perhexa TMH: 1,1-Bis(t-hexylperoxy)-3,3,5-trimethylcyclohexane

Perbutyl P: 1,1′-Bis(t-butylperoxy)diisopropylbenzene

SAYTEX8010: Ethylenebis(pentabromophenyl)

BT-93W: Ethylenebistetrabromophthalimide

PBS64HW: Brominated polystyrene

SO-25R: Spherical silica

Production of Prepreg

A glass fabric (E Glass, manufactured by Nitto Boseki Co., Ltd.) havinga thickness of 0.1 mm was impregnated with the resin varnishes obtainedin Preparation Examples 1 to 11 and Comparative Preparation Examples 1to 8, and then the resultant was dried by heating at 100° C. for 5minutes, to produce prepregs having a resin-containing proportion of 50%by weight of Preparation Examples 1 to 11 and Comparative PreparationExamples 1 to 8, respectively. In addition, the cases of using the resinvarnishes of Preparation Examples 1 to 11 correspond to the FabricationExamples 1 to 11, respectively, and the cases of using the resinvarnishes of Comparative Preparation Examples 1 to 8 correspond to theComparative Fabrication Examples 1 to 8, respectively.

Evaluation of Prepreg

The external appearance and tackiness of the above-mentioned prepregs ofFabrication Examples 1 to 11 and Comparative Fabrication Examples 1 to 8were evaluated. The evaluation results are presented in Table 2. Theexternal appearance was evaluated by naked eyes, and a prepreg havingsome irregularities, streaks and the like on the surface, and havinginsufficient surface smoothness was rated as “poor”, while a prepreghaving no irregularities, streaks or the like, and being uniform wasrated as “good”. Also, for the tackiness of the prepreg, the prepregwhich showed any stickiness (tackiness) on the surface at 25° C. wasrated as “poor” otherwise rated as “good”.

Production of Double-sided Copper-clad Laminate

A construct produced by stacking 4 sheets of the prepreg from each ofthe Fabrication Examples 1 to 11 and Comparative Fabrication Examples 1to 8 (not pressed) was provided, and low profile copper foil (F3-WS, Msurface Rz: 3 μm, manufactured by Furukawa Electric Co., Ltd.) having athickness of 18 μm was disposed on both sides of the construct such thatthe M surface was in contact with the prepreg. The assembly was moldedby hot pressing under the pressing conditions of 200° C. and 2.9 MPa for70 minutes, to produce a double-sided copper-clad laminate (thickness:0.5 mm). Furthermore, for each of the prepregs of Fabrication Example 1and Comparative Fabrication Example 1, a double-sided copper-cladlaminate using a general copper foil (GTS, M surface Rz: 8 μm,manufactured by Furukawa Electric Co., Ltd.) having a thickness of 18 μmas the copper foil, was produced under the same pressing conditions asthe conditions used in the case of using low profile copper foil. Inaddition, the combinations of the prepregs of Fabrication Examples 1 to11 and Comparative Fabrication Examples 1 to 8 and the copper foil usedtherewith in the copper-clad laminates of Examples 1 to 12 andComparative Examples 1 to 9, are presented in Table 2.

Evaluation of Features of Double-sided Copper-clad Laminate

For the copper-clad laminates of Examples 1 to 12 and ComparativeExamples 1 to 9, the transmission loss, dielectric properties, copperfoil peeling strength, solder heat resistance and thermal expansioncoefficient were evaluated. The evaluation results are presented inTable 2. The methods for evaluating the properties of a copper-cladlaminate are as follows.

Measurement of Transmission Loss and Dielectric Properties

The transmission loss of a copper-clad laminate was measured by atriplate line resonator method using a vector-type network analyzer. Inaddition, the measurement conditions were as follows; line width: 0.6mm, distance of insulating layer between the upper and lower groundconductors: about 1.0 mm, line length: 200 mm, characteristic impedance:about 50Ω, frequency: 3 GHz, measurement temperature: 25° C. From theobtained transmission loss, the dielectric properties (dielectricconstant, dielectric dissipation factor) at 3 GHz were calculated.

Measurement of Copper Foil Peeling Strength

The copper foil peeling strength of the copper-clad laminate wasmeasured according to the testing standards for copper-clad laminates,JIS-C-6481 (measured in steady state).

For the measurement, a copper-clad laminate was produced, and then thecopper foil was etched to produce lines for measurement and testing(width: 10 mm±0.1 mm). Subsequently, the peeling strength was measuredat a peeling rate of about 50 mm/min.

Evaluation of Solder Heat Resistance of Copper-clad Laminate

Each of the above-mentioned copper-clad laminates was cut to a square 50mm on each side, and was subjected to etching of the copper foil on oneside or both sides, and the laminate was maintained in its steady stateor in a pressure cooker test (PCT) apparatus (conditions: 121° C., 2.2atmospheres) for a predetermined time (1, 3 and 5 hours). Then, thelaminate was immersed in molten solder at 288° C. for 20 seconds, andthe external appearance of the obtained copper-clad laminate (threesheets) was examined by naked eyes. In addition, the numbers in thetable mean the number of sheets that were not recognized to haveoccurrences of swelling or measling within the substrate (within theinsulating layer) as well as between the substrate and the copper foil.

Evaluation of Thermal Expansion Coefficient of Copper-clad Laminate

Each of the above-mentioned copper-clad laminates was subjected toetching of the copper foil on both sides, and cut to a square 5 mm oneach side. The thermal expansion coefficients (in the direction of sheetthickness, 30 to 130° C.) of the laminates were measured by TMA.

TABLE 2 Dielectric Prepreg properties Dielectric dissipation Externalconstant factor Resin varnish Prepreg Copper foil appearance Tackiness(3 GHz) (3 GHz) Example 1 Preparation Example 1 Fabrication Example 1Low profile foil ◯ ◯ 3.27 0.0032 Example 2 Preparation Example 1Fabrication Example 1 Common foil ◯ ◯ 3.27 0.0032 Example 3 PreparationExample 2 Fabrication Example 2 Low profile foil ◯ ◯ 3.30 0.0034 Example4 Preparation Example 3 Fabrication Example 3 Low profile foil ◯ ◯ 3.230.0033 Example 5 Preparation Example 4 Fabrication Example 4 Low profilefoil ◯ ◯ 3.24 0.0032 Example 6 Preparation Example 5 Fabrication Example5 Low profile foil ◯ ◯ 3.25 0.0031 Example 7 Preparation Example 6Fabrication Example 6 Low profile foil ◯ ◯ 3.26 0.0032 Example 8Preparation Example 7 Fabrication Example 7 Low profile foil ◯ ◯ 3.270.0031 Example 9 Preparation Example 8 Fabrication Example 8 Low profilefoil ◯ ◯ 3.30 0.0032 Example 10 Preparation Example 9 FabricationExample 9 Low profile foil ◯ ◯ 3.24 0.0031 Example 11 PreparationExample 10 Fabrication Example 10 Low profile foil ◯ ◯ 3.30 0.0031Example 12 Preparation Example 11 Fabrication Example 11 Low profilefoil ◯ ◯ 3.25 0.0033 Comparative Comparative Preparation ComparativeFabrication Low profile foil ◯ ◯ 3.70 0.0054 Example 1 Example 1 Example1 Comparative Comparative Preparation Comparative Fabrication Commonfoil ◯ ◯ 3.70 0.0054 Example 2 Example 1 Example 1 ComparativeComparative Preparation Comparative Fabrication Low profile foil ◯ ◯3.93 0.0163 Example 3 Example 2 Example 2 Comparative ComparativePreparation Comparative Fabrication Low profile foil X X 3.27 0.0034Example 4 Example 3 Example 3 Comparative Comparative PreparationComparative Fabrication Low profile foil X X 3.45 0.0042 Example 5Example 4 Example 4 Comparative Comparative Preparation ComparativeFabrication Low profile foil X X 3.31 0.0036 Example 6 Example 5 Example5 Comparative Comparative Preparation Comparative Fabrication Lowprofile foil X X 3.71 0.0144 Example 7 Example 6 Example 6 ComparativeComparative Preparation Comparative Fabrication Low profile foil ◯ ◯3.76 0.0160 Example 8 Example 7 Example 7 Comparative ComparativePreparation Comparative Fabrication Low profile foil ◯ ◯ 3.31 0.0037Example 9 Example 8 Example 8 Solder heat resistance ThermalTransmission Peeling (steady state, after PCT treatment) expansion lossstrength Steady coefficient (dB/m, 3 GHz) (kN/m) state PCT 1 h PCT 3 hPCT 5 h (ppm/° C.) Example 1 3.64 0.82 3 3 3 3 60 Example 2 4.29 1.12 33 3 3 60 Example 3 3.72 0.84 3 3 3 3 59 Example 4 3.65 0.81 3 3 3 3 53Example 5 3.62 0.93 3 3 3 3 60 Example 6 3.57 0.90 3 3 3 3 61 Example 73.62 0.92 3 3 3 3 60 Example 8 3.56 0.91 3 3 3 3 55 Example 9 3.65 0.953 3 3 3 61 Example 10 3.57 0.77 3 3 3 3 65 Example 11 3.57 0.78 3 3 3 351 Example 12 3.68 0.82 3 3 3 3 55 Comparative 5.02 0.58 3 3 3 1 65Example 1 Comparative 5.72 0.92 3 3 3 3 65 Example 2 Comparative 11.040.72 3 3 3 2 56 Example 3 Comparative 3.74 0.49 3 2 0 0 88 Example 4Comparative 4.24 0.55 3 3 1 0 84 Example 5 Comparative 3.86 0.56 3 1 0 076 Example 6 Comparative 9.73 0.70 3 3 2 0 84 Example 7 Comparative10.64 0.79 3 2 1 0 80 Example 8 Comparative 3.90 0.80 3 3 3 3 73 Example9

Comparison was made between low profile foil and common foil in the casewhere the resin varnishes and prepregs derived from the same resincomposition were used, as can be seen from Examples 1 and 2 or fromComparative Examples 1 and 2. In this case, the resin compositions withlow profile foil had excellent transmission loss properties, but incontrast, the resin compositions with low profile foil had inferiorpeeling strength between the resin composition and the low profile foil(peeling strength). Particularly, in Comparative Example 1 where lowprofile foil was used with a conventional resin composition, slightimprovement was seen in the transmission loss, from 5.72 dB/m of thecommon foil to 5.02 dB/m of the low profile foil; however, the peelingstrength was lowered from 0.92 kN/m of the common foil to 0.58 kN/m ofthe low profile foil, which value is insufficient in actual use.

This demonstrates, as stated with regard to the problems describedabove, that low profile foil is superior to common foil in the loweringof transmission loss, and vice versa for the peeling strength betweenthe resin composition and metal foil, and for that reason, it isdifficult to achieve a balance between the lowering of transmission lossand the required peeling strength between the resin composition andmetal foil.

Furthermore, as is obvious from Table 2, the prepregs from Examples 1 to12 utilizing the resin composition of the present invention all had noirregularities, streaks or the like in the external appearance, and theywere uniform. Also, the prepregs were free of tackiness (tackiness ofthe surface), and thus had excellent prepreg properties. The propertiesof the laminates were also excellent, with the dielectric constant being3.30 or less, and the dielectric dissipation factor being 0.0034 orless. The solder heat resistance was good in all of the three sheets ofmeasurement samples, without any occurrence of swelling or measlingbeing recognized. The laminates also had good thermal expansionproperties, with the thermal expansion coefficient being 65 ppm/° C. orless.

With regard to the transmission loss and peeling strength, in Example 2where the resin composition of the present invention and common foilwere used, the transmission loss was remarkably excellent, with a valueof 4.29, and the peeling strength was also excellent with a value of1.12 kN/m, compared to Comparative Example 2 where common foil was usedsimilarly.

The copper-clad laminates of Examples 1 and 3 to 12 where the resincomposition of the present invention and low profile foil were used, hadparticularly excellent transmission loss, with a value of 3.72 or less,regardless of the use of low profile foil, and had excellent peelingstrength, with a value of 0.77 or more. Thus, it is clear that the resincomposition of the present invention is a resin composition which isvery effective in achieving a balance between the lowering oftransmission loss and peeling strength.

Comparative Examples 1 and 2 relate to a system of polyphenylene etherand triallyl isocyanurate, and Comparative Example 1 corresponds to theinventions of Patent Documents 4 and 5 in the case of using low profilefoil instead of common foil, while Comparative Example 2 using commonfoil corresponds to the inventions of Patent Documents 4 and 5. Thissystem has good prepreg properties and thermal expansion coefficient,but has inferior dielectric constant, dielectric dissipation factor andtransmission loss. Also, in the case of using low profile foil, thepeeling strength is deteriorated, and the solder heat resistance isdeteriorated, thus the comprehensive performance being unsatisfactory.

Comparative Example 3 relates to a system of polyphenylene ether and abismaleimide compound, and corresponds to the invention of PatentDocument 2 in the case of using low profile foil instead of common foil.This system has good prepreg properties and thermal expansioncoefficient, but has inferior dielectric constant, dielectricdissipation factor and transmission loss. The system also has inferiorpeeling strength and inferior solder heat resistance, thus thecomprehensive performance being unsatisfactory.

Comparative Example 4 relates to a system of conventional,non-compatibilized polyphenylene ether and a butadiene homopolymer, andcorresponds to the inventions of Patent Documents 6 and 7 in the case ofusing low profile foil instead of common foil. This system has gooddielectric constant, dielectric dissipation factor and transmissionloss, but has inferior prepreg properties, peeling strength, solder heatresistance, and thermal expansion coefficient, thus the comprehensiveperformance being unsatisfactory. Since this system is subject tomacro-phase separation, it can be easily distinguished by naked eyesfrom the samples prepared using the compatibilized composition of thepresent invention.

Comparative Example 5 relates to a system of conventional,non-compatibilized polyphenylene ether, a butadiene homopolymer, andtriallyl isocyanurate. This system has insufficient dielectric constant,dielectric dissipation factor and transmission loss, and has inferiorprepreg properties, peeling strength, solder heat resistance, andthermal expansion coefficient, thus the performance in general beinginferior. Since this system is subject to macro-phase separation, it canbe easily distinguished by naked eyes from the samples prepared usingthe compatibilized composition of the present invention.

Comparative Example 6 relates to a system of polyphenylene ether, abutadiene homopolymer and a maleimide compound, and corresponds to aresin composition which has the same components as the resin compositionof the present invention, and is not compatibilized. This system hasinsufficient dielectric constant, dielectric dissipation factor andtransmission loss, and has inferior prepreg properties, peelingstrength, solder heat resistance, and thermal expansion coefficient,thus the performance in general being inferior. Since this system issubject to macro-phase separation, it can be easily distinguished bynaked eyes from the samples prepared using the compatibilizedcomposition of the present invention.

Comparative Example 7 relates to a system of conventional,non-compatibilized polyphenylene ether, glycol-modified polybutadieneand a maleimide compound, and corresponds to the invention of PatentDocument 8 in the case of using low profile foil instead of common foil.This system has interior dielectric constant, dielectric dissipationfactor and transmission loss, and has inferior prepreg properties,peeling strength, solder heat resistance, and thermal expansioncoefficient, thus the performance in general being inferior. Since thissystem is subject to macro-phase separation, it can be easilydistinguished by naked eyes from the samples prepared using thecompatibilized composition of the present invention.

Comparative Example 8 relates to a system of polyphenylene ether,carboxylic acid-modified polybutadiene and a maleimide compound, andcorresponds to the invention of Patent Document 8 in the case of usinglow profile foil instead of common foil. This system has good prepregproperties and peeling strength, but has inferior dielectric constant,dielectric dissipation factor and transmission loss, and inferior solderheat resistance and thermal expansion coefficient, thus thecomprehensive performance being insufficient.

Comparative Example 9 relates to a system produced in the same manner asin Example 1, using a chemically unmodified butadiene polymer havingless than 40% of the 1,2-vinyl structure, which is inapplicable to thepresent invention. Since this system has decreased curabilityconcomitant to the decrease of crosslinking density as compared to thepresent invention, the dielectric dissipation factor and thermalexpansion coefficient are inferior to those of Example 1.

INDUSTRIAL APPLICABILITY

The resin composition of the present invention has a novel constitutionof being a thermosetting resin composition of compatibilized, uncuredsemi-IPN composite, and therefore, in the case of producing printedcircuit boards using the resin composition and the like of the presentinvention, the resin composition has excellent electric properties oflowering transmission loss or good dielectric properties in highfrequency bands, and excellent properties such as good heat resistanceafter moisture absorption or low thermal expansion properties, andsufficiently high peeling strength between the resin composition andmetal foil (particularly, low profile foil).

Furthermore, a resin varnish, a prepreg and a metal clad laminated boardcan be formed using the resin composition of the present invention. Theresin composition of the present invention, and the resin varnish,prepreg and metal clad laminated board using the resin composition,allowed lowering in the dielectric loss due to an enhancement ofdielectric properties of the resin product itself, and thus animprovement of electric properties could be achieved. Furthermore, theresin composition and the like of the present invention have excellentproperties of being applicable to metal foils having typical surfaceroughness, as well as even to metal foils having small surfaceroughness. For that reason, a combination of the resin composition ofthe present invention and a metal foil having small surface roughnessfurther reduces conductor loss, and thus could achieve an improvement inthe electric properties. Therefore, the combination can achieve adecrease in the transmission loss in high frequency bands to the extentthat the level of requirements in the printed circuit boards industry isreached, and thus can be suitably used in the production of printedcircuit boards used in high frequency applications.

Furthermore, since the resin composition, resin varnish, prepreg andmetal clad laminated board of the present invention can achieve theabove-mentioned properties, they are useful for the applications inmembers and elements of printed circuit boards that are used in variouselectric and electronic devices, such as mobile telecommunicationdevices dealing with high frequency bands, for example, signals of highfrequencies of 1 GHz or greater, or devices for the base stations,network-associated electronic devices such as servers and routers, andlarge scale computers.

1. A thermosetting resin composition comprising a polyphenyleneether-modified butadiene prepolymer which includes a polyphenylene ether(A) and a butadiene polymer, characterized in that the thermosettingresin composition is obtained by a process for manufacture of thethermosetting resin composition wherein: the butadiene polymer has acrosslinked structure; the process has a step (1) in which a butadienepolymer (B) crosslinks with a crosslinking agent (C) (excluding thebutadiene polymer (B)) in the presence of the polyphenylene ether (A) ina medium to obtain the polyphenylene ether-modified butadieneprepolymer; a number average molecular weight of the polyphenylene ether(A) is in a range of 7,000 to 30,000; the butadiene polymer (B) moleculecontains 40% or more of a 1,2-butadiene unit having a 1,2-vinyl group ina side chain; the butadiene polymer (B) is not a modified polybutadienein which the 1,2-vinyl group in the side chain, or one or both of theterminals in the molecule, is chemically modified to be converted toepoxy, glycol, phenol, maleic acid, (meth)acryl, or urethane, and thecrosslinking agent (C) is at least one maleimide compound including2,2-bis(4-(4-maleimidophenoxy)phenyl)propane or includingbis-(3-ethyl-5-methyl-4-maleimidophenyl)methane.
 2. The thermosettingresin composition according to claim 1, wherein: the butadiene polymer(B) comprises: (j) a —[CH₂—CH═CH—CH₂]— unit and (k) a —[CH₂—CH(CH═CH₂)]—unit, with a ratio of j:k being 60 to 5:40 to 95; and the crosslinkingagent (C) is a compound having one or more ethylenically unsaturateddouble bonds in a molecule.
 3. The thermosetting resin compositionaccording to claim 1, wherein: the crosslinking agent (C) is at leastone maleimide compound including2,2-bis(4-(4-maleimidophenoxy)phenyl)propane.
 4. The thermosetting resincomposition according to claim 1, wherein: the crosslinking agent (C) isat least one maleimide compound includingbis-(3-ethyl-5-methyl-4-maleimidophenyl)methane.
 5. The thermosettingresin composition according to claim 1, wherein: a mixing proportion ofthe polyphenylene ether (A) is in a range of 2 to 200 parts by weightbased on 100 parts by weight of the total amount of the butadienepolymer (B) and the crosslinking agent (C), and a mixing proportion ofthe crosslinking agent (C) is in a range of 2 to 200 parts by weightbased on 100 parts by weight of the butadiene polymer (B).
 6. Thethermosetting resin composition according to claim 1, wherein: aconversion rate of the crosslinking agent (C) falls in the range of 5 to100% in the step (1).
 7. The thermosetting resin composition accordingto claim 1, wherein: a radical reaction initiator (D) is furtherincorporated in the step (1) and then the butadiene polymer (B)crosslinks with the crosslinking agent (C).
 8. The thermosetting resincomposition according to claim 1, wherein: the process further comprisesa step (2) in which the polyphenylene ether-modified butadieneprepolymer obtained in the step (1) is incorporated with a radicalreaction initiator (D).
 9. The thermosetting resin composition accordingto claim 1, wherein: the process further comprises a step (2) in whichthe polyphenylene ether-modified butadiene prepolymer obtained in thestep (1) is incorporated with a compound (E) of a crosslinkable monomeror crosslinkable polymer which contains one or more groups having anethylenically unsaturated double bond in a molecule.
 10. Thethermosetting resin composition according to claim 1, wherein: theprocess further comprises a step (2) in which the polyphenyleneether-modified butadiene prepolymer obtained in the step (1) isincorporated with a compound (E) of a crosslinkable monomer orcrosslinkable polymer which is at least one selected from the groupconsisting of a butadiene polymer (B-1), maleimide compounds andstyrene-butadiene copolymers; and the butadiene polymer (B-1) is not amodified polybutadiene in which the 1,2-vinyl group in the side chain,or one or both of the terminals in the molecule, is chemically modifiedto be converted to epoxy, glycol, phenol, maleic acid, (meth)acryl, orurethane.
 11. The thermosetting resin composition according to claim 1,wherein: the process further comprises a step (2) in which thepolyphenylene ether-modified butadiene prepolymer obtained in the step(1) is incorporated with a compound (F) of at least one of abromine-based flame retardant and a phosphorus-based flame retardant.12. The thermosetting resin composition according to claim 1, wherein:the process further comprises a step (2) in which the polyphenyleneether-modified butadiene prepolymer obtained in the step (1) isincorporated with inorganic filler (G).
 13. A resin varnish for printedcircuit boards, obtained by dissolving or dispersing the thermosettingresin composition according to claim 1 in a solvent.
 14. A prepregobtained by impregnating the resin varnish for printed circuit boardsaccording to claim 13 into a substrate, and then drying the impregnatedsubstrate.
 15. A metal clad laminated board obtained by stacking one ormore sheets of the prepreg for printed circuit boards according to claim14, disposing metal foil on one side or both sides of the stackedprepreg, and pressing them together while heating.
 16. The thermosettingresin composition according to claim 1, wherein said step (1) is apreliminary reaction step in which the butadiene polymer (B) reacts withthe crosslinking agent (C) so as to obtain said polyphenyleneether-modified butadiene prepolymer, in an uncured state before completecuring, having mutual entanglement of molecular chains of thepolyphenylene ether (A) and crosslinking product between the butadienepolymer (B) and the crosslinking agent (C).
 17. The thermosetting resincomposition according to claim 1, which is a homogeneous composition.